Digital innovation begins with electronic materials built with 'super-gap' technology
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Samsung SDI leverages its expertise in organic and inorganic materials design so as to provide materials solutions for a semiconductor business that requires high-performing and highly integrated memory and process chips for cutting-edge devices, e.g. mobile phones and laptops. A race to reduce nanometers in semiconductor chips is revealing impurities and defects that have been avoiding detection before. Samsung SDI’s superb technology in refining and defect control helps eliminate such defects. Stability of a device is more vital than ever as semiconductor device functions keep stacking. Samsung SDI’s exceptional competence in composition design and reliability assurance technology makes it possible to bring forth differentiated packaging solutions that protect semiconductor devices from external impact, moisture, or damage, ensuring stable performance of the semiconductor devices.
SOH is a coating material used to form micro-patterns in the semiconductor. With rigidity and selection ratio, SOH has deep etching capability. Samsung SDI makes SOH products that replaced the conventional chemical vapor deposition (CVD) process with the spin-coating process, which enabled process streamlining, productivity improvement, and cost reduction – a holistic contribution to advancing semiconductor process technologies.
SOD is a coating material that insulates between transistors or layers, serving to prevent voids between micro-patterns as it has low reactivity. Samsung SDI applied the spin-coating process to its SOD, departing from the conventional CVD process, which enabled process streamlining, productivity improvement, and cost reduction – a holistic contribution to advancing semiconductor process technologies.
CMP slurry is an abrasive which is used to smoothen the surface of wafers in a chemical and mechanical mechanism, enabling higher planarization and lower defect rate. Samsung SDI's CMP slurry portfolio consists of oxide slurry, metal (W, Cu) slurry, ceria slurry.
EUV materials enable an ultra-micro EUV wavelength of 13.5 nanometers in semiconductor patterns. Samsung SDI is developing and mass-producing photoresists, under-layers and thinners through proprietary patents and joint evaluation.
CIS-CR materials are photoresists that implement pixel colors in CMOS image sensors working as RGB color processing filters. Samsung SDI's CIS-CR materials enable micro-patterning that achieves high resolution and high color fidelity while minimizing pixel color crosstalk.
EMC is a thermoset molding compound that protects semiconductor devices from external environments such as moisture and impact and effectively dissipates heat arising from operating chips. Samsung SDI provides EMC materials for DRAM, NAND, and foundry applications that meet rising standards of semiconductor packaging becoming lighter and thinner.
PID is a photosensitive patterning insulator, part of insulation layers in metal interconnects of a next-generation semiconductor packaging structure. PID features high resolution and high reliability in heat resistance and chemical resistance. Samsung SDI customizes PID products to suit each varying need of customers.
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