PV Paste

Paste for Photovoltaic

This device transforms sunlight into electric energy. It absorbs photovoltaic energy and creates an electric charge which is separated, moved and then generates electric current. The electric energy created in this way is widely used for power plant and even for your home.

Samsung SDI PV paste

Product Introduction

Samsung SDI PV paste Product

Samsung SDI has been a manufacturer of silver pastes for over 15 years. Since 2010, we began to supply silver metallization paste to the PV industry. Our competitiveness is our ability work with our customers to understand their technology goals and develop pastes that optimize their process. Also, our goal is to improve our customers’ cell efficiency and reduce their cell’s cost through our innovative paste technology.

Technical Road-map

Technical Road-map - 2014, 2015, 2016, 2017
2014 2015 2016 2017
Trend of Photovoltaic Cell
Samsung SDI PV paste Technical Roadmap
Samsung’s Paste
Samsung SDI PV paste Technical Roadmap

Product Specifications

  • PA-SF8700 SERIES Show specs
    • Next generation front side metallization paste

      8700s has much larger area of Ag-Si direct contact than the conventional paste to improve a contact resistance in Solar cell.

      Next generation front side metallization paste - High Isc Maximized shadowing loss Narrow line width, SERIES, Low Rs Low contact R Low line R, High Voc Minimized recombination Low junction damage, Good Printing High aspect ratio Smooth roughness after ring
      High Isc
      Maximized shadowing loss
      Narrow line width
      Low Rs
      Low contact R
      Low line R
      High Voc
      Minimized recombination
      Low junction damage
      Good Printing
      High aspect ratio
      Smooth roughness after ring
      High Isc
      Maximized shadowing loss
      Narrow line width
      Fine line patten(40㎛ → 30㎛)
      Low Rs
      Low contact R
      Low line R
      Uniform ARC etching
      Low specic resistance
      High Voc
      Minimized recombination
      Low junction damage
      Control contact withAg
      cristallite and emitter
      Good Printing
      High aspect ratio
      Smooth roughness after ring
      Control rheology with
      organic system
    • LOW CONTACT R

      8700s has much larger area of Ag-Si direct contact than the conventional paste to improve a contact resistance in Solar cell.
      It is effectively penetrate into SiNx layer dufiring firing, and provide low contact resistance up to 150/sq. wafer S/R.

    • HIGH A/R & STRAIGHT PATTERN

      It provides an excellent pattern shape and high aspect ratio with reduced dead area to achieve high Isc and low Rs.

    • BETTER CONTACT R AT LOW TEMP. FIRING

      One of the essential characteristic is that 8700s has a broad firing window and is suitable for low temperature firing.
      Therefore, it is a promising material for upcoming device such as PERC.

    • SERIES R ON HIGH S/R WAF

      Electrode of 8700s containing enhanced Ag-Si direct contact in interfacial layers, has more stable Rs than the conventional Ag paste on high S/R wafers.

    • TYPICAL PROPERTIES
      TYPICAL PROPERTIES - VISCOSITY (Pa.s), THIXOTROPIC INDEX, SOLID CONTENTS (%), SOLDERABILITY
      VISCOSITY (Pa.s) THIXOTROPIC INDEX SOLID CONTENTS (%) SOLDERABILITY
      VISCOSITY (Pa.s) 5.5~7.5 THIXOTROPIC INDEX 5.5~7.5 SOLID CONTENTS (%) 90.0~92.0% SOLDERABILITY Excellent
      Test condition
      • Viscosity : Brookeld HBT, 10 rpm , #14 spindle, at 23°C Thixotropic index : 10 rpm / 100 rpm
      • Solid Contents : TGA, 20°C / min., Residue at 600°C
      • Solderability : Pb/Sn (Non Ag) or Ag included. Soldering Temp. : 340~370°C, 5~10 sec.
  • PA-SF8630 SERIES Show specs
    • Front Side Metallization for Solar Cells

      PA-SF8630 series has a broad margin for printability and emitter doping profile.
      8630 series has a good printability and narrow width under the mass production condition.

      HIGHER EFFICIENCY
      • Excellent contact on emitters up to 100 ohm/sq.
        • - Good Voc and contact resistance
        • - High ll factor.
      • High Isc : exhibit narrow width
      BETTER PRINTABILITY
      • Excellent printability
        • - Can be printed up to 35 m width (screen mask)
        • - Excellent ne line resolution
      • Wide process window
      • Good adhesion to Ag or Ag-free ribbon
    • TYPICAL PROPERTIES
      TYPICAL PROPERTIES - VISCOSITY (Pa.s)), THIXOTROPIC INDEX, SOLID CONTENTS (%), SOLDERABILITY
      VISCOSITY (Pa.s) THIXOTROPIC INDEX SOLID CONTENTS (%) SOLDERABILITY
      VISCOSITY (Pa.s) 250~450 THIXOTROPIC INDEX 5.5~7.5 SOLID CONTENTS (%) 90.0~92.0% SOLDERABILITY Excellent
      Test condition
      • Viscosity : Brookeld HBT, 10 rpm , #14 spindle, at 23°C Thixotropic index : 10 rpm / 100 rpm
      • Solid Contents : TGA, 20°C / min., Residue at 600°C
      • Solderability : Pb/Sn (Non Ag) or Ag included. Soldering Temp. : 340~370°C, 5~10 sec.
  • PA-SD7000 SERIES Show specs
    • Second Layer Double Printing Paste for Solar Cells

      PA-SD7000 series pastes have a lower grid line resistance and enhance the Voc property by less firing through design. 7000 series pastes have an excellent printability and narrow width under the mass production condition and have a wide solderability window and strong adhesion.

      HIGHER EFFICIENCY
      • Reduced recombination at Ag/Si interlayer
      • Good contact resistance on emitters up to 100ohm/sq

        - Excellent Voc and contact resistance

      BETTER PRINTABILITY
      • Excellent printability
        • - Suitable for line openings up to 30 m(Screen Mask)
        • - Excellent ne line resolution
      • Good adhesion to Ag or Ag-free ribbon
      • Wide process window
    • TYPICAL PROPERTIES
      TYPICAL PROPERTIES - GRADE, VISCOSITY (Pa.s), THIXOTROPIC INDEX, SOLID CONTENTS (%), SOLDERABILITY
      GRADE VISCOSITY (Pa.s) THIXOTROPIC INDEX SOLID CONTENTS (%) SOLDERABILITY
      GRADE 7100B VISCOSITY (Pa.s) 250~450 THIXOTROPIC INDEX 5.5~7.5 SOLID CONTENTS (%) 90.0~92.0% SOLDERABILITY Excellent
      Test condition
      • Viscosity : Brookeld HBT,10 rpm, #14 spindle, at 23°C Thixotropic index : 10 rpm / 100 rpm
      • Solid Contents : TGA, 20°C / min., Residue at 600°C
      • Solderability : Pb/Sn (Non Ag) or Ag included. Soldering Temp. : 340~370°C, 5~10 sec.
  • PA-SB5000 SERIES Show specs
    • Front-Side Bus-bars Silver Paste

      PA-SB5000 series pastes have an excellent welding adhesion and solderability.
      5000 series pastes are designed for non-firing through to emitter to minimize Voc loss and good printability and electrical conductivity.

      LOW PASTE CONSUMPTION
      • Reduce paste consumption up to 12%
      • Same efficiency with high solid contents paste
      HIGH RELIABILITY
      • Good adhesion to Ag or Ag-free ribbon
      • Wide process window
      • Good interface property with finger line.
    • TYPICAL PROPERTIES
      TYPICAL PROPERTIES - GRADE, VISCOSITY (Pa.s), THIXOTROPIC INDEX, SOLID CONTENTS (%), SOLDERABILITY
      GRADE VISCOSITY (Pa.s) THIXOTROPIC INDEX SOLID CONTENTS (%) SOLDERABILITY
      GRADE 5100A VISCOSITY (Pa.s) 150~200 THIXOTROPIC INDEX 2.5~4.5 SOLID CONTENTS (%) 60.0~71.0% SOLDERABILITY Excellent
      GRADE 5300B VISCOSITY (Pa.s) 250~350 THIXOTROPIC INDEX 2.5~4.5 SOLID CONTENTS (%) 79.0~81.0% SOLDERABILITY Excellent
      Test condition
      • Viscosity : Brookeld HBT, 10 rpm, #14 spindle, at 23°C Thixotropic index : 10 rpm / 100 rpm
      • Solid Contents : TGA, 20°C / min., Residue at 600°C
      • Solderability : Pb/Sn (Non Ag) or Ag included. Soldering Temp. : 340~370°C, 5~10 sec
  • Next generation front side metallization paste

    8700s has much larger area of Ag-Si direct contact than the conventional paste to improve a contact resistance in Solar cell.

    Next generation front side metallization paste - High Isc Maximized shadowing loss Narrow line width, SERIES, Low Rs Low contact R Low line R, High Voc Minimized recombination Low junction damage, Good Printing High aspect ratio Smooth roughness after ring
    High Isc
    Maximized shadowing loss
    Narrow line width
    Low Rs
    Low contact R
    Low line R
    High Voc
    Minimized recombination
    Low junction damage
    Good Printing
    High aspect ratio
    Smooth roughness after ring
    High Isc
    Maximized shadowing loss
    Narrow line width
    Fine line patten(40㎛ → 30㎛)
    Low Rs
    Low contact R
    Low line R
    Uniform ARC etching
    Low specic resistance
    High Voc
    Minimized recombination
    Low junction damage
    Control contact withAg
    cristallite and emitter
    Good Printing
    High aspect ratio
    Smooth roughness after ring
    Control rheology with
    organic system
  • LOW CONTACT R

    8700s has much larger area of Ag-Si direct contact than the conventional paste to improve a contact resistance in Solar cell.
    It is effectively penetrate into SiNx layer dufiring firing, and provide low contact resistance up to 150/sq. wafer S/R.

  • HIGH A/R & STRAIGHT PATTERN

    It provides an excellent pattern shape and high aspect ratio with reduced dead area to achieve high Isc and low Rs.

  • BETTER CONTACT R AT LOW TEMP. FIRING

    One of the essential characteristic is that 8700s has a broad firing window and is suitable for low temperature firing.
    Therefore, it is a promising material for upcoming device such as PERC.

  • SERIES R ON HIGH S/R WAF

    Electrode of 8700s containing enhanced Ag-Si direct contact in interfacial layers, has more stable Rs than the conventional Ag paste on high S/R wafers.

  • TYPICAL PROPERTIES
    TYPICAL PROPERTIES - VISCOSITY (Pa.s), THIXOTROPIC INDEX, SOLID CONTENTS (%), SOLDERABILITY
    VISCOSITY (Pa.s) THIXOTROPIC INDEX SOLID CONTENTS (%) SOLDERABILITY
    VISCOSITY (Pa.s) 5.5~7.5 THIXOTROPIC INDEX 5.5~7.5 SOLID CONTENTS (%) 90.0~92.0% SOLDERABILITY Excellent
    Test condition
    • Viscosity : Brookeld HBT, 10 rpm , #14 spindle, at 23°C Thixotropic index : 10 rpm / 100 rpm
    • Solid Contents : TGA, 20°C / min., Residue at 600°C
    • Solderability : Pb/Sn (Non Ag) or Ag included. Soldering Temp. : 340~370°C, 5~10 sec.
  • Front Side Metallization for Solar Cells

    PA-SF8630 series has a broad margin for printability and emitter doping profile.
    8630 series has a good printability and narrow width under the mass production condition.

    HIGHER EFFICIENCY
    • Excellent contact on emitters up to 100 ohm/sq.
      • - Good Voc and contact resistance
      • - High ll factor.
    • High Isc : exhibit narrow width
    BETTER PRINTABILITY
    • Excellent printability
      • - Can be printed up to 35 m width (screen mask)
      • - Excellent ne line resolution
    • Wide process window
    • Good adhesion to Ag or Ag-free ribbon
  • TYPICAL PROPERTIES
    TYPICAL PROPERTIES - VISCOSITY (Pa.s), THIXOTROPIC INDEX, SOLID CONTENTS (%), SOLDERABILITY
    VISCOSITY (Pa.s) THIXOTROPIC INDEX SOLID CONTENTS (%) SOLDERABILITY
    VISCOSITY (Pa.s) 250~450 THIXOTROPIC INDEX 5.5~7.5 SOLID CONTENTS (%) 90.0~92.0% SOLDERABILITY Excellent
    Test condition
    • Viscosity : Brookeld HBT, 10 rpm , #14 spindle, at 23°C Thixotropic index : 10 rpm / 100 rpm
    • Solid Contents : TGA, 20°C / min., Residue at 600°C
    • Solderability : Pb/Sn (Non Ag) or Ag included. Soldering Temp. : 340~370°C, 5~10 sec.
  • Second Layer Double Printing Paste for Solar Cells

    PA-SD7000 series pastes have a lower grid line resistance and enhance the Voc property by less firing through design. 7000 series pastes have an excellent printability and narrow width under the mass production condition and have a wide solderability window and strong adhesion.

    HIGHER EFFICIENCY
    • Reduced recombination at Ag/Si interlayer
    • Good contact resistance on emitters up to 100ohm/sq

      - Excellent Voc and contact resistance

    BETTER PRINTABILITY
    • Excellent printability
      • - Suitable for line openings up to 30 m(Screen Mask)
      • - Excellent ne line resolution
    • Good adhesion to Ag or Ag-free ribbon
    • Wide process window
  • TYPICAL PROPERTIES
    TYPICAL PROPERTIES - GRADE, VISCOSITY (Pa.s), THIXOTROPIC INDEX, SOLID CONTENTS (%), SOLDERABILITY
    GRADE VISCOSITY (Pa.s) THIXOTROPIC INDEX SOLID CONTENTS (%) SOLDERABILITY
    GRADE 7100B VISCOSITY (Pa.s) 250~450 THIXOTROPIC INDEX 5.5~7.5 SOLID CONTENTS (%) 90.0~92.0% SOLDERABILITY Excellent
    Test condition
    • Viscosity : Brookeld HBT,10 rpm, #14 spindle, at 23°C Thixotropic index : 10 rpm / 100 rpm
    • Solid Contents : TGA, 20°C / min., Residue at 600°C
    • Solderability : Pb/Sn (Non Ag) or Ag included. Soldering Temp. : 340~370°C, 5~10 sec.
  • Front-Side Bus-bars Silver Paste

    PA-SB5000 series pastes have an excellent welding adhesion and solderability.
    5000 series pastes are designed for non-firing through to emitter to minimize Voc loss and good printability and electrical conductivity.

    LOW PASTE CONSUMPTION
    • Reduce paste consumption up to 12%
    • Same efficiency with high solid contents paste
    HIGH RELIABILITY
    • Good adhesion to Ag or Ag-free ribbon
    • Wide process window
    • Good interface property with finger line.
  • TYPICAL PROPERTIES
    TYPICAL PROPERTIES - GRADE, VISCOSITY (Pa.s), THIXOTROPIC INDEX, SOLID CONTENTS (%), SOLDERABILITY
    GRADE VISCOSITY (Pa.s) THIXOTROPIC INDEX SOLID CONTENTS (%) SOLDERABILITY
    GRADE 5100A VISCOSITY (Pa.s) 150~200 THIXOTROPIC INDEX 2.5~4.5 SOLID CONTENTS (%) 60.0~71.0% SOLDERABILITY Excellent
    GRADE 5300B VISCOSITY (Pa.s) 250~350 THIXOTROPIC INDEX 2.5~4.5 SOLID CONTENTS (%) 79.0~81.0% SOLDERABILITY Excellent
    Test condition
    • Viscosity : Brookeld HBT, 10 rpm, #14 spindle, at 23°C Thixotropic index : 10 rpm / 100 rpm
    • Solid Contents : TGA, 20°C / min., Residue at 600°C
    • Solderability : Pb/Sn (Non Ag) or Ag included. Soldering Temp. : 340~370°C, 5~10 sec
Click on the button to move to the page.